Samsung and Broadcom expand AI chip collaboration worth over $200 billion through 2030
Samsung Electronics and Broadcom signed a memorandum of understanding to expand their strategic collaboration across memory and foundry technologies for AI infrastructure. The companies expect the collaboration to be valued at more than $200 billion across memory and foundry over the next five years through 2030. On the memory side, Samsung and Broadcom plan to collaborate on the supply of High Bandwidth Memory (HBM) to support Broadcom's next-generation AI accelerators. In foundry, the collaboration focuses on Samsung's 2-nanometer and below process technologies for Broadcom's products, including Wireless Broadband Communications solutions, and extends to advanced packaging technologies including 2.3D and 2.5D integration. The MOU was announced during the AI Summit in San Francisco, with attendees including Jinman Han, President and Head of Samsung Electronics' Foundry Business, and Hock Tan, President and CEO of Broadcom.